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product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays. 1/14 tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 ? 14? 001 36v 1ch dc brush motor drivers bd62110aefj general description bd62110aefj is a built-in 1 channel h-bridge motor driver for dc brush motors. this driver can facilitate low power consumption by direct pwm. there are built in protection circuits in this ic. each protection circuit operation contributes to set high reliability. features ? single power supply input (rated voltage of 36v) ? rated output current (peak):1.0a(2.0a) ? low on-resistance dmos output ? forward, reverse, brake, open ? external pwm control ? driver for dc brush motor ? built-in logic input pull-down resistor ? cross-conduction prevention circuit ? thermal shutdown circuit (tsd) ? over-current protection circuit (ocp) ? under voltage lock out circuit (uvlo) ? over voltage lock out circuit (ovlo) ? ghost supply prevention (protects against malfunction when power supply is disconnected) ? adjacent pins short protection ? inverted mounting protection ? htsop-j8 package application plain paper copier (ppc), multi-function printer, laser printer, inkjet printer, photo printer, fax, mini printer and etc. key specifications ? power supply voltage range: 8 to 28 [v] ? rated output current: 1.0 [a] ? rated output current (peak): 2.0 [a] ? operating temperature range: -25 to +85 [c] ? output on-resistance: 1.8 [ ? ] (typ) (total of upper and lower resistors) package w(typ) x d(typ)x h(max) htsop-j8 4.90mm x 6.00mm x 1.00mm typical application circuit figure 1. typical application circuit test vcc out2 out1 gnd in2 in1 datashee t
2/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 test in1 gnd out2 out1 vcc gnd in2 pin configuration block diagram figure 2. pin configuration figure 3. block diagram pin descriptions pin no. pin name function pin no. pin name function 1 gnd ground terminal 5 in1 h bridge control terminal 2 out1 h bridge output terminal 6 in2 h bridge control terminal 3 vcc power supply terminal 7 test test terminal (connected to gnd) 4 gnd ground terminal 8 out2 h bridge output terminal predriver uvlo regulator 5 6 1,4 control logic ovlo forward reverse brake open tsd ocp 8 2 3 3 4 2 1 8 7 6 5 3
3/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 absolute maximum ratings (ta=25c) parameter symbol rating unit supply voltage v cc -0.2 to +36.0 v power dissipation pd 0.82 (note 1) w 3.75 (note 2) input voltage for control pin v in -0.2 to +5.5 v output current i out 1.0 (note 3) a/ch output current (peak) i outpeak 2.0 (note 4) a/ch operating temperature range topr -25 to +85 c storage temperature range tstg -55 to +150 c (note 1) when mounted on 70mm70mm1.6mm glass epoxy boar d. reduced by 4.7mw/c w hen operating above ta=25c. (note 2) when mounted using 4-layers, reduce d by 30mw/c when oprating above ta=25c. (note 3) do not, however exceed pd and tjmax=150c. (note 4) pulse width tw ?
4/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 application information 1. points to notice for termi nal description and pcb layout (1) in1, in2/ h bridge control terminal it decides output logic for h bridge. input output state in1 in2 out1 out2 l l open open stop h l h l forward l h l h reverse h h l l brake (2) test/ terminal for testing this is the terminal used at the time of distribution test. please connect to gnd. please be careful because there is a possibility of malfunction if it is not connected to gnd. (3) vcc/ power supply terminal motor?s drive current is flowing in it, so please connect it in such a way that the wire is thick & short and has low impedance. vcc voltage may have great fluctuation, so please connect the bypass capacitor (100uf to 470uf) as close as possible to the terminal. adjust in such a way that the vcc voltage is stable. please increase the capacitance if needed, especially when large current or moto rs that have great back electr omotive force are used. in addition, to reduce the power supply?s impedance in wide frequency bandwidth, parallel connection of multi-layered ceramic capacitor (0.01f to 0.1f) is recommended. extr eme care must be observed to make sure that the vcc voltage does not exceed the rating even for a moment. mor eover, there is a built-in cl amp component in the output terminal to prevent electrostatic destruction. if sudden pu lse or surge voltage of more than the maximum absolute rating is applied, the clamp component operates which can result to destructi on. please be sure to not exceed the maximum absolute rating. it is effective to mount a zener di ode with maximum absolute rating. also, diode is inserted between vcc terminal and gnd terminal to prevent electros tatic destruction. if reverse voltage is applied between vcc terminal and gnd terminal, there is a dang er of ic destruction so please be careful. (4) gnd/ ground terminal in order to reduce the noise caused by switching current and to stabilize the internal reference voltage of ic, please connect it in such a way that the wiring impedance from this terminal is made as low as possible to achieve the lowest electrical potential no matte r what operating state it may be. (5) out1,out2/ h bridge output terminal motor?s drive current is flowing in it, so please connect it in such a way that the wire is thick & short and has low impedance. it is also effective to add a schottky diode if out put has great positive or negative fluctuation when large current is applied. for example, a coun ter electromotive voltage etc. is grea t. moreover, there is a built-in clamp component in the output terminal to prevent electrostatic de struction. if sudden pulse or surge voltage of more than the maximum absolute rating is applied, the clamp component operates which can result to destruction. please be sure to not exceed the maximum absolute rating.
5/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 protection circuits (6) thermal shutdown (tsd) this ic has a built-in thermal shutdown circuit for the rmal protection. when the ic?s chip temperature rises above 175c (typ), the motor output becomes open. also, when the temperature returns to under 150c (typ), it automatically returns to normal operation. however, even when tsd is in operation, if heat is continued to be applied externally, heat overdrive can lead to destruction. (7) over-current protection (ocp) this ic has a built in over-current protection circuit as a provision against destruction when the motor outputs are shorted to each other or vcc-motor output or motor output-gnd is shorted. this circuit latches the motor output to open condition when the regulated threshold current flows for 4
6/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 2. external pwm control this series can drive motors by in1and in 2 input directly from the microcomputer. decay mode can be slow decay or fast decay. slow decay (forward rotation) fast decay (synchronous rectification, forward rotation) figure 4. route of regenerativ e current during current decay input output state in1 in2 out1 out2 h l h l on h h l l slow decay h l h l on h h l l slow decay h l h l on input output state in1 in2 out1 out2 h l h l on l h l h fast decay h l h l on l h l h fast decay h l h l on on to off off to on m on to off off to on fast decay slow decay on to off off to on m on to on off to off output on current decay
7/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 thermal calculation the ic?s consumed power can be estimated roughly with the power supply voltage (v cc ), circuit current (i cc ), output on-resistance (r onh , r onl ) and motor output current value (i out ). the calculation method during external pwm drive, sl ow decay, driving channel 1 only is shown here: ?? ? ? ? ? ? ? ? ? ? ? ? ? ? ??? ?? ?? ?? ? ? ?? decay current during duty on a iout ronl on output during duty on a iout ronl ronh w dmos output the of power consumed 100 / % _ 100 2 100 / % _ ] [ 2 2 ? ? ? ? ? ? ? ? ? ? ? ? ? ?? ? ? ? ? ? ? ? ? ? ?
8/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 3. application circuit diagram figure 6. block diagram & application circuit diagram constant voltage control or external pwm control (a) input/output table (b) example of external pwm control sequence slow decay (forward rotation) fast decay (forward rotation) input output state in1 in2 out1 out2 l l open open stop h l h l forward l h l h reverse h h l l brake input output state in1 in2 out1 out2 h l h l on h h l l slow decay h l h l on h h l l slow decay h l h l on input output state in1 in2 out1 out2 h l h l on l h l h fast decay h l h l on l h l h fast decay h l h l on 7 terminal for testing connect to gnd. bypass capacitor. setting range is 100f to 470f (electrolytic) 0.01f to 0.1f(multilayer ceramic etc.) refer to page 4 for detail. control input terminal. input pwm signal at external pwm control. refer to page 6 for detail. m predriver 3 vcc uvlo 5 in1 6 in2 8 out2 2 out1 1 gnd control logic ovlo 100f 0.1f forward reverse brake open test tsd ocp 4 gnd
9/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 i/o equivalent circuits figure 7. i/o equivalent circuits vcc circuitry gnd out2 out1 10k ? ?
10/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance s upply lines. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperatur e and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature rati ng be exceeded the rise in te mperature of the chip may result in deterioration of the properti es of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the ex pected characteristics of the ic can be approximately obtained. the electrical characteristics are guar anteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consi deration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage.
11/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 operational notes ? continued 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connec ted to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signif icant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic . the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 8. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s maximum junction temperature rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the ts d circuit that will turn off a ll output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 14. over current protection circuit (ocp) this ic incorporates an integrated overcu rrent protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit.
12/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 power dissipation htsop-j8 package htsop-j8 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. also, the back of board as well as the surfaces has large areas of c opper foil heat dissipation patterns, greatly increasing power dissipation. the back metal is shorted with the back side of the ic chip, being a gnd potential, therefore there is a possibility for malfunction if it is shorted with any potential other than gnd, which should be avoided. also, it is recommended t hat the back metal is soldered onto the gnd to short. please note that it has b een assumed that this product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation efficiency. figure 9. htsop-j8 power dissipation ambient temperature:ta[c] power dissipation >8 pd[w] 1.0 100 125 0 3.75w 4 2.11w 3 1.10w 2 0.82w 1 2.0 3.0 4.0 75 50 25 150 85 measurement machine >8 th156 (kuwano electric) measurement condition >8 rohm board board size >8 70mm x 70mm x 1.6mm (with through holes on the board) board
13/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 ordering information b d 6 2 1 1 0 aef j -e 2 part number package type efj :htsop-j8 packaging and forming specification e2: reel-wound embossed taping marking diagram htsop-j8(top view) 62110a part number marking lot numbe r 1pin mark
14/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 physical dimension, tape and reel information package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
15/15 datasheet d a t a s h e e t bd62110aefj tsz02201-0p2p0b700870-1-2 ? 2016 rohm co., ltd. all rights reserved. 2016.05.17 rev.001 www.rohm.com tsz22111 15 001 revision history date revision changes 25.ma y .2016 001 new release
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd62110aefj package htsop-j8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes bd62110aefj - web page

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